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U2762B
900-MHz ISM Band Receiver
Description
The receiver IC U2762B-B is specifically designed for cordless telephone applications in the 900-MHz ISM band. It is manufactured using TEMIC Semiconductors' advanced UHF process. The IC consists of a 900-MHz RF amplifier and mixer, 10.7-MHz IF amplifier, limiter, RSSI, quadrature demodulator and comparator for the bit-slicer function. The device features 2.9-V operation. In conjunction with TEMIC Semiconductors' transmitter IC U2763B-B and the PLL U2781B, a complete ISM RF IC kit is available which fits perfectly with AMD's PhoX controllers AM79C432A and AM79C433. Electrostatic sensitive device. Observe precautions for handling.
Features
D Single-conversion receiver with 10.7-MHz IF D Comparator for bit slicer integrated D Temperature-compensated RSSI with 65 dB D D D D
dynamic range Supply-voltage range 2.7 V to 3.3 V Only 17 mA typical current consumption Few external components SSO28 package
Benefits
D Low filter costs due to 10.7-MHz single conversion D Very low count of external components saves PCB
space and costs
D Low current consumption results in very long
stand-by time of approximately 7 days
Block Diagram
VCC1 28 LO REF 27 LO in 26 GND1 25 A2 out 24 VCC2 23 Lim1 in 22 Lim1 REF 21 Lim1 out 20 GND3 19 Lim2 in 18 Lim2 REF 17 DEM NTank 16 DEM Tank 15
Mix
A2 RSSI Demo- dulator Vcc/2 Compa- rator 10 k + -
A1
1 n.c.
2 RSSI
3 A1 REF
4 A1 in
5 GND2
6 Mix out
7 VCC3
8 A2 in
9 A2 REF
10 Data out
11 Com Nin
12 Com in
13 SL in
14 DEM out
13951
Figure 1. Block diagram
Ordering Information
Extended Type Number U2762B-BFS U2762B-BFSG3 Package SSO28 SSO28 Remarks Tube, MOQ 600 pcs Taped and reeled, MOQ 4000 pcs
Rev. A3, 19-May-99
1 (9)
Preliminary Information
U2762B
Pin Description
n.c. 1 RSSI 2 A1 REF 3 A1 in GND2 4 5 28 VCC1 27 LO REF 26 LO in 25 GND1 24 A2 out 23 VCC2 22 Lim1 in 21 Lim1 REF 20 Lim1 out 19 GND3 18 Lim2 in 17 Lim2 REF 16 DEM NTank 15 DEM Tank
13960
Mix out 6 VCC3 A2 in 7 8
Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28
A2 REF 9 Data out 10 Com Nin 11
Com in 12 SL in 13 DEM out 14
Figure 2. Pinning
Symbol n.c. RSSI A1 REF A1 in GND2 Mix out VCC3 A2 in A2 REF Data out Com Nin Com in SL in DEM out DEM Tank DEM NTank Lim2 REF Lim2 in GND3 Lim1 out Lim1 REF Lim1 in VCC2 A2 out GND1 LO in LO REF VCC1
Function Not connected Signal-strength indicator RF reference RF input IF ground Mixer output IF and AF power supply IF amplifier A2 input IF amplifier A2 reference Data output Comparator reference Comparator input / slicer output Slicer input Demodulator output Quadrature filter Quadrature filter Limiter 2 reference Limiter 2 input IF and AF Ground Limiter 1 output Limiter 1 reference Limiter 1 input IF power supply 1 IF amplifier A2 output RF ground Local oscillator input Local oscillator reference RF power supply
Functional Description
RF Amplifier / Mixer
The RF amplifier / mixer down-converts the antenna signal to the IF frequency. It has asymmetrical RF and IF ports. The LO input includes an amplifier for good sensitivity and can be used in symmetrical- as well as asymmetrical configuration.
Demodulator
The quadrature demodulator in the receiving path contains an internal 7-pF quadrature capacitor to couple the IF signal to the external tank providing the 90-degree phase shift. The tank may be either an LC-tank circuit or an alignment-free discrete ceramic resonator.
IF Amplifier A2
An additional gain stage enables an application-specific insertion point for IF filtering.
Bit-Slicer Amplifier and Comparator
The bit-slicer limits the baseband signal. Furthermore it eliminates the DC-offset by an AC-coupled lowpass filter to the demodulator output. A second lowpass filter recovers the exact comparator threshold value of the bit-slicer's output. The time constants of both lowpass filters can be selected independently from each other to optimize power-up timing. Rev. A3, 19-May-99
Limiter 1 / 2
The two-stage limiting amplifier is designed to be directly coupled to low-cost 10.7-MHz ceramic IF filters in front of each stage. The total dynamic range is 65 dB. 2 (9)
Preliminary Information
U2762B
Absolute Maximum Ratings
Parameters Supply voltage Input voltages Input voltages Junction temperature Storage temperature Pins 7, 23, 28 Pins 1, 2, 6, 10, 14, 20 and 24 Pins 3, 4, 8, 9, 11, 12, 13,15, 16, 18, 21, 22, 26 and 27 Symbol VCC Vin Vin Tj Tstg Value 0 to 3.5 0 to VCC 0 to VCC - 1 V 125 -40 to +125 Unit V V V
_C _C
Thermal Resistance
Parameters Junction ambient SSO28 Symbol RthJA Value 130 Unit K/W
Operating Range
Parameters Supply voltage Ambient temperature Symbol VS Tamb Value 2.7 to 3.3 0 to 70 Unit V _C
Electrical Characteristics Cascaded A1 and MX1
Temperature range: 0_C to 70_C
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Pin 28 Pin 4 Pin 4
Parameters Supply-voltage range Supply current A1MX1 turn-on time RF input impedance RF input SWR RF input frequency LO input impedance LO input frequency A1/MX1 cascaded insertion voltage gain
Test Conditions / Pins
Symbol VCC ISA1on tA1MX1on ZA1in fin
Min. 2.7
Typ. 2.9 6.5 2.5 50 < 2:1 2
Max. 3.3
Unit V mA
ms W
800 800 21
1200 1200 27
Pins 26, 27
Noise figure 1-dB compression point Output voltage @ 1 dB compression 3rd-order intercept point
LO to RF leakage LO to IF leakage IF output impedance
MX1LO = 916.8 MHz MX1RF = 927.5 MHz Pin = -40 dBm PLOin = -20 dBm SSB Input Pin 4 MX1LO = 916.8 MHz, MX1RF = 927.5 MHz, Pin 6 fLO = 980 MHz PLO = -20 dBm fRF1 = 1 GHz fRF2 = 995 MHz PRF = -40 dBm, Pin 4 PLO = -20 dBm Pin 4 PLO = -20 dBm Pin 6 @10.7-MHz IF single ended Pin 6
fLOin GVA1MX1
24
VSWR MHz kW MHz dB
NF P1dB P1dBout IIP3
11.5 -27 104 -15
dB dBm dBmV dBm
LMX1Zout
-50 62 330
dBm dBmV
W
Rev. A3, 19-May-99
3 (9)
Preliminary Information
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Common Electrical Characteristics IF/AF System
Parameters Supply-voltage range Supply current Supply current Single ended Test Conditions / Pins Pins 7, 23 Pin 7 Pin 23 Pin 24 Symbol V7, V23 I7 I23 LMX2out Min. 2.7 260 Typ. 2.9 4.9 6.0 330 Max. 3.3 400 Unit V mA mA
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Electrical Characteristics A2
Electrical Characteristics RSSI/Lim1 and Lim2
U2762B
4 (9) RSSI fall time RSSI rise time Output impedance Lim1/Lim2 cascaded voltage gain Limiter 1 Lim1 input impedance Lim1 input frequency Lim1 output impedance Voltage gain Limiter 2 Lim2 input impedance Lim2 input frequency RSSI Dynamic range Output voltage Parameters -3 dB limiting at Lim1 input Parameters A2 turn-on time IF input impedance Input frequency Output frequency Gain Noise figure 1-dB compression point 3rd-order intercept point Output voltage @ 1 dB compression Output load Test Conditions / Pins Valid for -5 dB insertion loss for 2nd IF filter Pin 22 fIF = 10.7 MHz, PIFin = -110 dBm @ 20 dBmV @ 85 dBmV @10.7 MHz @10.7 MHz @10.7 MHz Test Conditions / Pins Pin 2 Pin 2 Pin 2 Pin 18 Pin 18 Pin 22 Pin 22 Pin 22 Pin 8 Pin 8 Pin 24 Pin 24 Pin 8 ZLIM2in fLIM2BW ZLIM1in fLIM1BW fLIM1out GLIM1 Symbol P3dB Symbol tA2on ZMX2in fMX2in fMX2out Gp NF P1dB IIP3 P1dBout GLIM12 DRSSI Vout tfRSSI trRSSI ZRSSI Min. Min. 260 1 260 1 260 260 20 0.1 1.7 8 10 || 3 Typ. Typ. 2.5 330 10.7 10.7 10 8 95 112 104 330 330 45 330 110 0.2 1.8
Preliminary Information
Rev. A3, 19-May-99 Max. 8 Max. 400 22 400 22 400 400 22 22 12 85 0.3 1.9 50 50 kW || pF dBmV V V Unit dBmV MHz MHz dB dB dBmV dBmV dBmV MHz MHz Unit dB dB
ms ms ms W W W W W
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Internal Pin Configuration Electrical Characteristics Slicer Amplifier
Parameters Open loop gain Output load Output swing Test Conditions / Pins Pin 13 to 12 AC load Pin 12 Pin 12 Symbol GSol LSout VHYST Min. 10 Typ. 40 0.7 25 Max. Unit dB kW V mV
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Electrical Characteristics Comparator Electrical Characteristics Demodulator
Parameters Ref. input impedance Output voltage `high' Output voltage `low' Output low-to-high rise time Output high-to-low fall time Hysteresis DC output voltage Output load Demodulator output voltage Parameters Demodulator 3 db BW Demodulator total harmonic distortion Test Conditions / Pins Pin 14 fmod = 36 kHz fdev = 40 kHz Pin 14 fIFin = 10.7 MHz fmod = 36 kHz Pin 14 fdev = 40 kHz fIFin = 10.7 MHz Pin 14 Pin 14 Test Conditions / Pins Pin 11 RLOAD > 10 kW Pin 10 RLOAD > 10 kW Pin 10 RLOAD = 10 kW Pin 10 CLOAD = 10 pf RLOAD = 10 kW Pin 10 CLOAD = 10 pf Pin 12 Symbol fDEMODBW THD Symbol ZCOMPin VoutH VoutL tr VDout LDout tf VCC-0.3 Min. Min. 10 Typ. 100 Typ. 200 <3 150 1.5
Rev. A3, 19-May-99
Figure 3. Pin 2: Signal strength indicator (RSSI) VCC 5 k 10 k 1 k
13956
Preliminary Information
2 Figure 4. Pins 3/4: RF reference / RF input 4 3 VCC 800 3.3 pF
U2762B
1 k
Max.
Max.
500
0.3 500
13957
mVrms
Unit kW V V ns
Unit kHz %
V kW
ns
5 (9)
U2762B
Internal Pin Configuration (continued)
VCC VCC 296 10 A 6 11
1 mA
13958
13963
Figure 8. Pin 11: Comparator reference VCC VCC
Figure 5. Pin 6: Mixer output 12 VCC 290 A 10 k
9
8
257
10 pF 13
80 A 800
13964 13959
Figure 6. Pins 8/9: IF amplifier A2 input / reference
Figure 9. Pin 12: Comparator input / Slicer output Pin 13: Slicer input . VCC
VCC 20 k 10 14 180 A
13962 13965
Figure 7. Pin 10: Data output
Figure 10. Pin 14: Demodulator output
6 (9)
Rev. A3, 19-May-99
Preliminary Information
U2762B
Internal Pin Configuration (continued)
VCC 20 k 7 pF 15,16 100 k 330 22 140 A 11 A
13966 13969
21
Figure 11. Pin 15/16: Quadrature filter Figure 14. Pins 21/22: Limiter 1 input / reference
17 330 18
VCC 272
24
1.1 mA
13970 13967
Figure 12. Pins 17/18: Limiter 2 input / reference
Figure 15. Pin 24: IF amplifier A2 output
VCC 240
26 27 20 1 k 1 k
440 A
13971 13968
Figure 13. Pin 20: Limiter 1 output
Figure 16. Pins 26/27: Local oscillator input / reference
Rev. A3, 19-May-99
7 (9)
Preliminary Information
U2762B
Application Circuit
C51 C52 C53 1nF FL4 C90 100pF VCC C65 C64 C58 100pF 1nF C0 8.2pF 1F 28 27 26 25 24 23 22 21 20 19 18 17 16 15 SL in C72 1F Data out 0.1F 100pF C54 1nF C47 1nF R87 560 Y2 100pF 0.1F LO in FCD1070MB115 TDK Ceramic Discriminator R88 560 DEM out
U2762B
1 A1 in C71 100pF C77 RSSI C83 4.7F C76 FL5 C79 FL4/5: SFE10.7MS3C10-A 0.1F C78 1nF 10k R99 R97 10k 10k R100 10k 2 3 4 5 6 7 8 9 10 11 12 13 14 R75 5.6k
100pF 0.01F 100pF
13972
Figure 17. Application circuit
Package Information
Package SSO28
Dimensions in mm
9.10 9.01 5.7 5.3 4.5 4.3
1.30 0.25 0.65 8.45 28 15 0.15 0.05 6.6 6.3 0.15
technical drawings according to DIN specifications
13018
1
14
8 (9)
Rev. A3, 19-May-99
Preliminary Information
U2762B
Ozone Depleting Substances Policy Statement
It is the policy of TEMIC Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify TEMIC Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2594, Fax number: 49 ( 0 ) 7131 67 2423
Rev. A3, 19-May-99
9 (9)
Preliminary Information

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